Three-dimensional integrated circuit

Results: 149



#Item
41SPTS Technologies and Fraunhofer IZM

SPTS Technologies and Fraunhofer IZM

Add to Reading List

Source URL: www.izm.fraunhofer.de

Language: English - Date: 2015-04-17 11:28:35
42Te ch n ology sca lin g a t a n in fle ct ion poin t  W H AT’S N EXT? Lode La u w e r s s, I M EC

Te ch n ology sca lin g a t a n in fle ct ion poin t W H AT’S N EXT? Lode La u w e r s s, I M EC

Add to Reading List

Source URL: www.hotchips.org

Language: English - Date: 2013-07-28 00:11:16
433D IC WORKING GROUP MEETING JANUARY 23, 2013 3D IC Working Group Meeting Agenda  1:30 pm

3D IC WORKING GROUP MEETING JANUARY 23, 2013 3D IC Working Group Meeting Agenda  1:30 pm

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-01-22 10:41:22
443D IC Readiness  GSA 3D IC Workshop October 22, 2014  Charles Woychik

3D IC Readiness GSA 3D IC Workshop October 22, 2014 Charles Woychik

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-10-23 00:17:41
45eda 2 asic  Silicon Integration Initiative (Si2) 3D Technical Advisory Board (3D TAB) Austin, Texas

eda 2 asic Silicon Integration Initiative (Si2) 3D Technical Advisory Board (3D TAB) Austin, Texas

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-10-23 00:20:52
46Three-dimensional opto-electric integration

Three-dimensional opto-electric integration

Add to Reading List

Source URL: phys.org

Language: English - Date: 2015-04-17 00:22:08
47F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M  DEPARTMENT OF High Density Interconnect & Wafer Level Packaging

F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging

Add to Reading List

Source URL: www.izm.fraunhofer.de

Language: English - Date: 2015-04-13 17:05:57
48FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM  3D S YS TEM INTEGRATION TS V INTERPOS ER Silicon interposers with through silicon vias (TSVs) are an important element for the realization of 3D system-in-pa

FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM 3D S YS TEM INTEGRATION TS V INTERPOS ER Silicon interposers with through silicon vias (TSVs) are an important element for the realization of 3D system-in-pa

Add to Reading List

Source URL: www.izm.fraunhofer.de

Language: English - Date: 2015-04-11 11:27:45
49qctconnect.com  QUALCOMM CONFIDENTIAL AND PROPRIETARY Roadmap for Design and EDA Infrastructure for 3D Products

qctconnect.com QUALCOMM CONFIDENTIAL AND PROPRIETARY Roadmap for Design and EDA Infrastructure for 3D Products

Add to Reading List

Source URL: www.hotchips.org

Language: English - Date: 2013-07-28 00:30:09
50F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M  Fraunhofer IZM – ASSID All Silicon System Integration Dresden  All Silicon System

F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System

Add to Reading List

Source URL: www.izm.fraunhofer.de

Language: English - Date: 2015-04-02 11:52:26